AMMCW10 Broadcom / Avago RF Amplifier 6 – 20 GHz dB datasheet, inventory, & pricing. Avago Technologies’ AMMC GHz MMIC is an efficient two-stage amplifier designed to be used as a cascadable intermediate gain block for EW. Description Agilent’s AMMC- GHz MMIC is an efficient two- stage amplifier designed to be used as a cascadable intermediate gain block for EW.
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6518 connection to the gate pad is needed for single drain-bias operation. The location of the RF bond pads is shown in Figure Temperature Coefficient of Gain based on sample test 5. This MMIC amjc exposed air bridges on the top surface and should be handled by the edges or with a custom collet do not pick up die with vacuum on die center. For microstripline applications, the chip should be attached directly to the ground plane e.
Operation in excess of any one of these conditions may result in permanent damage to this device. Personal grounding is to be worn at all times when handling these devices.
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This helps simplify the assembly process and reduces assembly related performance variations and costs. For improved reliability and moisture protection, the die is passivated at the active areas. A negative gate-pad voltage will decrease the drain current.
The following precautions are strongly recommended: Ablebond LM1 silver epoxy is recommended. RoHS Certificate of Compliance.
AVAGO AMMC-5618 RF Amplifier
Gain and Voltage Figure 8. No connection to the gate pad is needed for single drain- bias operation.
The recommended supply voltage is 3 to 5 V. Operation in excess of any one of these conditions may result in permanent damage to this device. Ablebond LM1 silver epoxy is recommended. A guided wedge at an ultrasonic power level of 64 dB can be used for the 0. Personal grounding is to be worn at all times when handling these devices.
RF connections should be kept as short as reasonable to minimize performance degradation due to undesirable series inductance. You have chosen to save the following item to a parts list:. Noise Figure Figure 6. No ground wires are required because all ground connections are made with plated through-holes to the backside of the device.
Caution should be taken to not exceed the Absolute Maximum Rating for assembly temperature and time. For best performance, the topside of the MMIC should be brought up to the same height as the circuit surrounding it.
May I be an agency of your products,and what’s yourterms? Save this item to a new parts list. Thermosonic wedge bonding is the preferred method for wire attachment to the bond pads.
Output Return Loss Figure 5. Noise Figure Figure 4. The gate-pad voltage is approximately zero volt during operation with no DC gate supply.
Please enter a message. The amount of epoxy used for chip and or shim attachment should be just enough to provide a thin fillet around the bottom perimeter of the chip or shim. This can be accomplished by mounting a gold plated metal shim same length and width as the MMIC under the chip, which is of the correct thickness to make the chip and adjacent circuit coplanar. Ensure that an ESD approved carrier is used when dice are transported from one destination to another.